We have some more news on AMD’s upcoming R300 series. The Radeon R9 380X and R9 380 which will be set to compete with NVIDIA’s GTX 980 and GTX 970 will be based on a new silicon called “Grenada”. This silicon is built on the 28 nm process and will be a refined version of “Hawaii” much like “Curacao” was to “Pitcarin” in the previous generation.
The Greneda chip will have the same specifications as Hawaii so you will have 2816 stream processors, 176 TMUs, 64 ROPs, and a 512-bit wide GDDR5 memory interface that holds 4 GB. Since this is a re-brand we expect AMD to increase the clock speeds to outperform the GTX 980 and GTX 970 from NVIDIA. The chip is not expected to be any more energy efficient than Hawaii.
AMD’s “Tonga” silicon that we saw make its debut with the Radeon R9 285 could make the foundation for the Radeon R9 370 series which will consist of the R9 370X and R9 370. Tonga has 2048 stream processors based on the GCN 1.3 architecture, 128 TMUs, 32 ROPs, and a 384-bit wide GDDR5 memory interface. Both the R9 370X and R9 370 could feature a standard of 3 GB of memory.
The only truly new silicon that we will see in the R9 300 series will be “Fiji”. This chip is specifically designed for AMD’s high-end single and dual-GPU solutions which will be the Radeon R9 390, R9 390X and R9 390X2. This chip features 4096 stream processors based on the GCN 1.3 architecture, 256 TMUs, 128 ROPs, and a 1024-bit wide HBM memory interface. It is expected that 4 GB will be the standard amount of memory on this card.