AMD’s upcoming Ryzen 3 3200G has been pictured and de-lidded. This processor will feature integrated graphics and be part of the tail-end of the company’s 3rd generation Ryzen desktop processor family. We know that while the “Matisse” MCM will make up a bulk of the 3rd generation Ryzen lineup, the APU lineup is rumored to be using older “Zen+” architecture.
The Ryzen 2 3200G is more than likely based off a derivative of the “Raven Ridge” silicon, but built on the 12 nm processor by GlobalFoundries, and will feature the innovations that AMD introduced with “Pinnacle Ridge”. These include an improved Precision Boost algorithm as well as faster on-die caches. Using 12 nm will aslo enable AMD to dial up the CPU and iGPU clock speeds and improve DDR4 memory support. Since the chip was de-lidded we can see that AMD is using thermal paste instead of solder, much like they did with “Raven Ridge”.
Via ChipHell Forums
