AMD’s EPYC Milan-X is the next-generation server CPU platform that will be based on AMD’s new packaging technology, aka X3D (3D V-Cache). The combination of 2.5 and 3D packaging technology will feature AMD Genesis-IO die along with stacked chiplets featuring a very large third level of cache. The cache might shoot up to 768MB, as per the latest leaks.
Back in May, Executable Fix was the first one to reveal this processor, and now he has some latest information which includes full specs of the four processors under the AMD EPYC 7003 portfolio. As per the leakster’s Twitter thread, the flagship Milan-X CPU, aka 7773X, will feature 64 cores and 128 threads while operating at a base clock speed of 2.2 GHz and could boost up to 3.5 GHz. It will require a TDP of 280W. The flagship model and other models will have 768MB of L3 Cache, which is thrice the original Milan series offered (up to 256MB).
The leakster also shared specifications for 7573X, 7473X, and 7373X. These models will feature 32, 24, and 16 cores, respectively. The 7473X and 7373X will be 240W TDP SKUs yet will feature the 768MB of L3 cache.
768MB for L3 cache probably means that each Core Complex has 32MB of its own, which has remained unchanged since the original Milan. However, the additional 64MB of V-Cache will be attached to each CCD. Another way to see this is that each processor will offer 8x 32 MB + 8x64MB of V-Cache.
Milan-X (GN-B2) has 768MB L3$ per CPU. Let's confirm the specs 🧵
7773X (64 cores)
2.2GHz base, 3.5GHz boost
768MB L3, 280W TDP— ExecutableFix (@ExecuFix) September 16, 2021