It looks like AMD is prepping not one, but three HEDT chipsets for its third generation Ryzen Threadripper processors. These new processors will come from the “Rome” MCM which features up to 64 CPU cores, an 8-channel DDR4 memory interface, and 128 PCIe gen 4.0 lanes. It looks like AMD will be breaking up their HEDT platform into two sub-platforms, one which will target gamers and enthusiasts, and the other which will target people who buy Xeon W processors like the W-3175X.
The gamer / enthusiast platform will be the TRX40 chipset. It will have a 4-channel DDR4 memory interface, 64 PCI-Express gen 4.0 lanes from the processor, and additional lanes from the chipset. This chipset should have a very similar feature-set to X570.
Moving up you have the TRX80 and WRX80 chipsets. These will likely leverage the full I/O of the “Rome” MCM with an 8-channel DDR4 memory interface and more than 64 PCI-Express 4.0 lanes. It is not clear what the difference will be between TRX80 and WRX80. It could be that WRX80 boards will be true workstation boards and will come in the SSI form factor.
These chipsets have made their way to USB-IF for certification and ASUS is first with their Prime TRX40-Pro, and the ROG Strix TRX40-E Gaming boards.