The first chipset diagram for AMD’s upcoming X570 chipset has surfaced online. While the X370 and X470 chipsets were designed by ASMedia, the X570 chipset will be the first in-house design from AMD. It has been confirmed that this chipset will leverage new PCI-Express 4.0 connectivity for new Ryzen 3000 processors.
The AMD X570 chipset will put out a total of 28 PCI-Express gen 4.0 lanes. 16 are allocated to PEG (PCI-Express graphics), which are configurable through external switches and redrivers either as a single x16 or two x8 slots. There are 4 lanes allocated to one M.2 NVMe slot. The remaining four slots serve as the chipset bus. Since X570 is going to support PCI-Express 4.0 the chipset bandwidth is expected to double to 64 Gbps. Because it is an SoC it will be wired to LCPIO (SuperIO controller). The processors integrated southbridge has two SATA 6 Gbps ports, one of which is switchable to the first M.2 slot, and four 5 Gbps USB 3.x ports. There is also an “Azalia” HD audio bus, which is directly wired to the SoC.
When it comes to downstream PCIe connectivity the X570 chipset really shines. It will put out 16 downstream PCI-Express gen 4.0 lanes. Two of these are allocated to two M.2 slots with x4 wiring each and the rest are x1 links put out as x1 slots. There is also one lane that drives an ASMedia ASM1143 controller (takes in one gen 3.0 x1 and puts out two 10 Gbps USB 3.x gen 2 ports); one lane driving the board’s onboard 1 GbE controller (choices include Killer E2500 or Intel i211-AT or even Realtek 2.5G); and one lane towards an 802.11ax WLAN card such as the Intel “Cyclone Peak.” Other southbridge connectivity includes a 6-port SATA 6 Gbps RAID controller, four 5 Gbps USB 3.x gen 1 ports, and four USB 2.0/1.1 ports.
It is also mentioned that the TDP of the X570 chipset will at least be 15 watts, which is a 3x increase over the 5W TDP of the X470 chipset. This might explain why we’ve seen fan-heatsinks on the leaked X570 boards.
Via ChipHell Forums