Gigabyte has seemingly addressed user concerns regarding a controversial “server-grade” thermal gel by removing its mention from the product page of its updated GeForce RTX 5070 Ti WINDFORCE OC V2 graphics card. This change suggests a potential shift away from the problematic thermal solution that had led to reports of leakage and overheating issues in earlier production runs.
Key Takeaways
- Gigabyte’s updated RTX 5070 Ti WINDFORCE OC V2 no longer lists the “server-grade” thermal conductive gel.
- Previous reports detailed thermal gel leaking from GPUs, particularly in vertically mounted systems.
- Gigabyte had previously attributed leakage to excessive application and stated it was cosmetic.
- The company appears to have reverted to traditional thermal pads for the V2 model.
The Thermal Gel Controversy
Earlier this year, multiple reports emerged detailing issues with Gigabyte’s “server-grade” thermal conductive gel, which was used on some GeForce RTX 50 series and Radeon RX 9000 series GPUs. Users reported that the gel was slowly leaking from the cards, especially in vertically mounted PC builds. In some instances, the leakage was significant enough that the material was no longer adequately covering the VRAM, potentially leading to overheating.
Gigabyte’s initial response to these reports was that the problem stemmed from an excessive application of the gel in early production batches. The company maintained that the material itself was capable of withstanding high temperatures and that the leakage was a cosmetic issue that did not impact performance or reliability. They also stated that later production runs had adjusted the application amount. However, evidence from users on forums suggested a more widespread problem affecting early batches.
A Shift to Traditional Thermal Pads
The updated Gigabyte GeForce RTX 5070 Ti WINDFORCE OC V2 graphics card now appears on Gigabyte’s website without any mention of the controversial thermal gel. Instead, it is implied that the company has returned to using traditional thermal pads for cooling components like VRAM and MOSFETs. This change comes after user feedback and reports of the gel’s problematic behavior, particularly in non-standard mounting configurations.
While Gigabyte has not issued a formal recall for affected units, the removal of the gel from newer product descriptions indicates a move towards a more conventional and seemingly reliable thermal solution. The exact reasons for Gigabyte’s decision—whether driven by cost, reliability concerns, or continued user dissatisfaction—remain undisclosed.
Via UNIKO’s Hardware
