Intel Broadwell-E HEDT Chips to Arrive in 2016

Intel has started to talk about the first details of their next-generation high-end desktop (HEDT) processors codenamed “Braodwell-E”. These Core i7 HEDT processors will be built in the existing LGA2011-3 package and will be compatible with current X99 motherboards (likely with a BIOS update). This is much like the case how Ivy Bridge-E was to Sandt Bridge-E as we will only see small updates and nothing new in terms of architecture.


Intel Core i7 Broadwell-E chips will be built on the 14nm silicon fab process and will have 6 to 8 cores based on the Broadwell micro-architecture. These cores will have up to 20MB of L3 cache. Since the chip is pin-compatible with Haswell-E its I/O will be the same, featuring a quad-channel DDR4 integrated memory controller. One difference might be that Intel’s entry level part could have the full 40 PCIe lanes as 28 lanes is not mentioned anywhere in the slide. These chips will have a TDP of 140W and Intel is expected to release them in 2016.

Source: VR-Zone | News Archive

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