Things seem to keep on getting worse for Intel, it appears they are now dealing with silicon fabrication issues. With the overwhelming demand on their 14nm fabs output capacity it seems Intel will be moving some of its chipsets back to the 22 nm node, specifically the H310 chipset. This is in an effort to clear production capability for the 14 nm node.
The 14 nm fabs are being hit with overwhelming demand as it is and reports have been flying that Intel is outsourcing 14 nm chip production to TSMC to also help. This would be a first since the company has been manufacturing its own chips.
If you didn’t know Intel’s chipsets are one manufacturing generation behind their CPUs. With issues on the 10nm process and constrained output of their 14 nm process it looks like at least the H310 chipset will be moving back from 14 nm to 22 nm. So the chipset will debut as H310C or H310 R2.0. It will obviously be physically larger and the boards making use of it will take a small power efficiency loss. On top of that these boards will now support Windows 7, via a software / driver solution. Reports are that motherboards with the revised chipset are already moving into the supply chain.