Intel’s upcoming Rocket Lake-S platform is expected to arrive late this year, although up until today we really did not have any concrete details on what it would bring. The leaked diagram below details many of those features. Rocket Lake-S will be a feature update to Comet Lake-S so you’ll see many features that are not present on current 300 and even upcoming 400 series motherboards.
The first thing about Rocket Lake-S is that it will feature a new core architecture. We are not sure what that will be, but rumors say that it will be a 14nm adoption of Tiger Lake, which is using Willow Cove cores.
One of the biggest changes of the platform is adding PCI-Express 4.0 support. The CPU will have direct 4.0 lanes as well as 4 additional lanes for storage (20 lanes total). This means that both your primary GPU and NVMe storage device will be directly linked to the CPU, not the PCH.
Direct Media Interface (DMI) will be upgraded to an x8 link, which means it will double its current transfer speed of x4. Intel does not say what this transfer speed will be, but the current x4 link has a transfer speed of 8 GT/s (3.93 GB/s).
The slide also confirms that Rocket Lake-S will have Xe graphics architecture. The upgrade to Xe will also bring with it HDMI 2.0b and DisplayPort 1.4a support.
Thunderbolt 4 will also be present as well as USB 3.2 20G.
Finally Intel Software Guard Extensions (SGX) have been removed to improve the security of the platform, as the SGX has proved to be quite vulnerable to many kinds of attacks and exploits.