Intel is expected to launch Skylake, which will be a completely new x86 microarchitecture at some point in 2015. Skylake will come after Broadwell and will be the “tock” in Intel’s tick-tock model. Skylake will be fabricated on the 14 nm process.
The most interesting information about Skylake is that it will support DDR4 memory.
There will be four different variations of Skylake products. U and Y will be ultra low power systems on a chip, H will be high-performance processors for mobile and AIO markets, and S will be desktop CPUs. The first two variations will integrate the Skylake Platform Controller Hub (PCH) on the die, the other two will be a two-chip solutions meaning they will require an external PCH chip. H and S chips will use DMI 3.0 interface to communicate with the PCH, DMI 3.0 will feature faster transfer rates than the current DMI 2.0, up to 8 GT/s. All of the Skylake processors will have a dual-channel memory controller that will support 1 DIMM per channel on U and Y products and 2 DIMMs per channel on H and S products.
U and Y series CPUs are effectively SoCs and will have 2 CPU cores and will support LPDDR3 memory up to 1600 MHz. The Y processors will have a GT2 GPU and a 4W TPD. U parts with GT2 graphics will have a 15W TDP and U parts with GT3 graphics and 64 MB of eDRAM will be rated at 15W and 28W TDP. In addition to LPDDR3, the U SoCs will also support DDR3L/DDR3L-RS memory with data rates up to 1600 MHz.
The H series CPUs are going to have 4 CPU cores with GT2 or GT4e graphics. The parts with GT2 graphics will have 35W and 45W TDPs. The H parts with GT4 graphics and 128 MB of eDRAM will have a 45W TDP. All of the H processors will support DDR4 memory with data rates of 2133 MHz.
Finally the S desktop parts will have three main configurations: 2 CPU cores with GT2 graphics, 4 CPU cores with GT2 graphics and 4 CPU cores with GT4 graphics and 64 MB of eDRAM. All of the configurations will be available with 35W and 65W TDPs. Quad-core processors with GT2 graphics will also be available with a 95W TDP. The S CPUs will support DDR3L/DDR3L-RS memory up to 1600 MHz and DDR4 memory up to 2133 MHz.
The H, U, and Y models will be made in three different types of BGA packages, and some of them will support configurable TDP. The S series CPUs will use the LGA 1151 package.
Source: CPU World | News Archive