It looks like we have updated information on how AMD will ship its Ryzen processors, the new box art, and the stock coolers that will come with the processors. AMD plans to ship the coolers in a few different ways, first you’ll see OEM trays (for system integrators), them you’ll have the PIB (Processor in Box) solution which will have 3 different variants (basic heatsink, Wraith Spire, and Wraith Max Cooling soltions), and then finally you’ll have WOF (without fan-heatsink consumer).
Looking at the graph above we can see the R7 1800X, R7 1700X, and R7 1700, the three processors which AMD is expected to launch first. The R7 1800X and R7 1700X will have the option to ship with the Wraith Max CPU Cooler. This cooler can handle TDPs of up to 140W, weighs in at 545 g, and has official dimensions of 105 mm x 108 mm x 85 mm (LxWxH). Here is what the box will look like for these processors that come with a cooling solution.
The R7 1700 has the option to ship with the Wraith Spire cooler, which can handle TDPs of up to 95W, weighs in at 452 g, and has official dimensions of 109 mm x 103 mm x 54 mm (LxWxH). Here is what the box will look like for these processors that come with a cooling solution.
Finally if you are purchasing a WOF (without fan-heatsink consumer) processor here is what that box will look like. I would say the new box art looks much better than what was earlier reported.