Heat Issues with Intel’s Upcoming High-Capacity SSDs

While referring to the capacity aspect, the SSDs have been trying to catch up with the HDDs in this department. This will lead to a greater shift of focus towards the NAND flash memory designers which will be required to help in the increase of the transistor densities using the new technologies of newer silicon fabrication. Since there is no such support from this aspect so far, the designers of SSD will have to use up more and more NAND flash chips to make room for higher capacities which are now in demand. There is obviously nothing 100 percent flawless in this approach. Two issues will have to be addressed since too many of these NAND flash chips are stored in one single place. First issue is of heating up and the other revolves around power.


It has been said that the two new SSDs from Intel, the “Fultondale” and “Pleasantdale”, will be dealing with these issues of heat and power. Some documents have been leaked from the company which gives an idea of what the readied version of the data center SSDs is going to look like.


The SSDs are going to be built around the 2.5-inch form-factor and they will be fashioned out of chunky metal with a top lid which is going to be retractable. The body is going to be doubled up as a heat sink; the metal ridges featured on the body helps to disperse the heat into the air which is brought in from the NAND flash chips. The drive is going to be featuring at least two PCBs. One of these is going to be responsible for the holding of the controller, cache RAM (if any), and some NAND flash chips and the other one is only going to deal with the NAND flash chips.

Intel is expected to unveil the two drives at IDF Beijing, in Q4-2014.

Source: VR-Zone | News Archive