Intel’s 200-Series chipset is almost upon us. The company is expected to launch their 7th generation Core “Kaby Lake” processors and companion 200-series chipset this January right in the middle of the 2017 International CES. The 200-series is expected to have a handful of new features, but nothing extraordinary. The succeeding 300-series chipset could standout though.
The 300-series chipset is expected to launch at the end of 2017 could reportedly come with wireless networking as part of the feature-set. Currently Intel motherboards that have WiFi capabilities make use of 3rd party controllers. The new 300-series will likely have native WLAN controllers (probably with external PHY for signal clarity). Intel is also planning to implement 10 Gb/s USB 3.1 (gen 2.0) controllers into the chipset.
This move by Intel could obviously impact 3rd party manufactures of both WLAN and USB 3.1 controllers.