Intel currently uses a fluid thermal interface material between the processor die and IHS (integrated heatspreader) on its processors and this has been a big complaint of PC enthusiasts. AMD uses a soldered IHS, which is believed to be more effective in heat transfer, across its Ryzen line of processors. Recent reports have been saying that at least Intel’s upcoming flagship processor the Core i9-9900K will come with a soldered IHS.
The Core i9-9900K will be an 8-core, 16-thread part running at 3.6 GHz and boosting all the way up to 5.0 GHz. With that much power having a soldered IHS will definitely help out with thermals as we noticed very high temperatures when testing the 6-core, 12-thread Core i7-8700K. It will be interesting to see if Intel does this with their entire 9th generation Core series or just the i9-9900K.
