Samsung has introduced an exceptionally thin new memory package. The Low-Power DDR5 (LPDDR5X) memory offers the highest speeds and large capacities in a slim design. This memory is increasingly being used to replace SODIMM DDR5 in laptops and is also found in many of the fastest smartphones available.
Samsung claims that the newest LPDDR5X memory is 9% thinner than the previous version and has a 21% improvement in heat resistance. It uses a 4-stack structure and offers capacities of up to 12GB and 16GB per module. This memory is produced with a 12nm manufacturing process.
Samsung states that this memory will allow mobile device manufacturers to save space and enhance airflow within their devices. The new memory includes optimized printed circuit boards (PCBs) and advanced epoxy molding compounds, making it as thin as a fingernail.
Moreover, Samsung intends to develop LPDDR5X memory with 6-layer and 8-layer structures, allowing for capacities of up to 24GB or even 32GB per module. This type of memory would be particularly suited for gaming handhelds that need high capacity without taking up much space. Currently, LPDDR5X memory is utilized in most Ryzen AI 300 “Strix Point” laptops and will also be incorporated into Intel’s Core Ultra 200V “Lunar Lake” series, which integrates the memory directly into the chip package.
Source: Samsung
