A newer version of Sony’s PS 5 features an improved SoC made with TSMC 6nm technology. The 7nm node, which is already in use in the PS5’s “Oberon” SoC, is backward-compatible with this smaller node.
The 6nm port of Oberon maintains the same design and layout as the original CPU. However, the fundamental Zen2 processing and RDNA2 graphics architectures have remained unchanged.
This new SoC was found only a few weeks after new console models were initially reported in Australia. The latest version has not only upgraded silicon powering the console but also improved internals like a redesigned mainboard and a smaller and lighter cooler. Earlier this month, Austin Evans released a comprehensive breakdown of the PS5’s latest edition.
In terms of features and specifications, the newer 260 mm2 Oberon Plus chip is identical to the larger 300 mm2 version but more power efficient. These adjustments allow the console to use less power and necessitate a less robust cooling system.
As a result, AMD and Sony in future will be able to fit more chips onto a single wafer, bringing down the per-unit cost of making the next console by an estimated 12 percent. Microsoft’s Xbox consoles are powered by AMD 7nm SoCs and are slated to receive 6nm design updates in the near future.