Intel Starts Mass Production Of Core Ultra 200V “Lunar Lake” At TSMC

According to industry sources cited by DigiTimes, TSMC has started producing 3nm chips for Intel’s upcoming client series, codenamed Lunar Lake. This product is scheduled for an official launch next quarter, though Intel has not yet specified an exact date. It marks Intel’s first use of TSMC nodes for all three chiplets in its disaggregated design, which includes the CPU tile and SoC tile with GPU. The Lunar Lake chips employ TSMC’s N3B and N6 nodes.

IMG 1988

Intel’s Lunar Lake is anticipated to debut as the Core Ultra 200V series and will be the first to incorporate Lion Cove P-Cores and Skymont E-Cores. These architectures will also be utilized in the Core Ultra 200 “Arrow Lake-S” for desktops, expected to launch in the fourth quarter. The primary differences between the two, aside from their platform and power targets, lie in their graphics capabilities.

IMG 1987

Intel’s Lunar Lake includes Xe2-LPG graphics, a low-power version of the Battlemage architecture, whereas Arrow Lake will feature Xe-LPG (Alchemist) graphics, similar to those in the Core Ultra 100 “Meteor Lake.” Another key difference is that Lunar Lake utilizes system memory integrated on the package (MoP). At Computex, Intel announced that Lunar Lake will launch in the third quarter, though a specific month was not disclosed. This new architecture will be part of the Microsoft Copilot+PC platform once certified.

Via Wccftech