The JEDEC Solid State Technology Associations who is responsible to set memory standard and specifications, has published the all-new DDR5 SDRAM standard. It largely emphasizes on the memory standard to keep up with cloud computing and enterprise servers, but naturally, it overlaps mainstream PCs for enthusiasts and gamers.
New Optimizations
The new DDR5 memory standard brings efficient performance standards. Therefore it addresses higher scaling performance without reducing channel efficiency. It is able to be achieved by doubling up the memory’s burst length to BL16 and increase bank count to 32. As a result, the DDR5 modules will have 2x 40-bit independent sub-channels to provide that efficiency and reliability.
Expected Features
Apart from performance and reliability increase, the new DDR5 standard brings in newer features. It will introduce Decision Feedback Equalization (DFE), I/O speed scalability and increased bandwidth to 4.8 Gbps, which is higher than DDR4’s End-of-Life speed at 3.2 Gbps.
The other DDR5 features are as follows:
- Fine-grain refresh feature: as compared to DDR4 all bank refresh improves 16 Gbps device latency. Same bank self-refresh offers better performance by enabling some banks to refresh while others are in use.
- On-die ECC and other scaling features enable manufacturing on advanced process nodes.
- Improved power efficiency enabled by Vdd going from 1.2 V to 1.1 V as compared to DDR4.
- Use of the MIPIÒ Alliance I3C Basic specification for system management bus.
- At the module level, the voltage regulator on DIMM design enables pay as you go scalability, better voltage tolerance for improved DRAM yields and the potential to further reduce power consumption.
All CPU and memory chip makers planning for DDR5
As of now, it is not known which platform will bring in DDR5. But naturally, both AMD and Intel will bring them in eventually. Intel, AMD, Micron and Samsung naturally have readied its future releases accordingly. It is extremely likely to see Alder Lake supporting DDR5 memory standard, which also brings in the new LGA 1700 socket. SK Hynix also said that it will be working with its partners to develop test chips and try its best to start mass productions before the end of 2020.
Source: JEDEC
